Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786627 | Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips | Martin Becker, Ronald Eisele, Jacek Rudzki | 2017-10-10 |
| 9613929 | Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof | Martin Becker, Ronald Eisele, Jacek Rudzki | 2017-04-04 |