Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735114 | Method of packaging semiconductor device | Beng Beng Lim, Yiu-Wai Lai | 2017-08-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735114 | Method of packaging semiconductor device | Beng Beng Lim, Yiu-Wai Lai | 2017-08-15 |