Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9812338 | Encapsulation of advanced devices using novel PECVD and ALD schemes | Zoltan Ring, Daniel Namishia | 2017-11-07 | $8,789,000 |
| 9640627 | Schottky contact | Saptharishi Sriram | 2017-05-02 | $1,476,000 |
| 9640623 | Semiconductor device with improved field plate | — | 2017-05-02 | $1,476,000 |
| 9608078 | Semiconductor device with improved field plate | Fabian Radulescu, Saptharishi Sriram, Daniel Etter | 2017-03-28 | $1,748,000 |
| 9607955 | Contact pad | Van Mieczkowski, Zoltan Ring, Jason Gurganus | 2017-03-28 | $1,748,000 |
| 9548206 | Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features | Jason Gurganus | 2017-01-17 | $5,854,000 |
| 9536783 | Wafer-level die attach metallization | Fabian Radulescu, Terry Alcorn, William T. Pulz, Van Mieczkowski | 2017-01-03 | $2,515,000 |