Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9656907 | Low expansion glass filler, method of manufacturing the same and glass frit including the same | Jhee-mann Kim, Jaemin Cha, Jaeho Lee | 2017-05-23 |
| 9656908 | Inorganic adhesive composition and hermetic sealing method using same | Jhee-mann Kim, Jaemin Cha, Jaeho Lee | 2017-05-23 |
| 9606916 | Semiconductor devices including application processor connected to high-bandwidth memory and low-bandwidth memory, and channel interleaving method thereof | Sung Hyun Lee, Jun Hee Yoo, Dongsoo Kang, Il Han Park, Euicheol Lim | 2017-03-28 |