Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780056 | Solder ball, manufacturing method thereof, and semiconductor device | Tzu-Han Hsu | 2017-10-03 |
| 9721913 | Semiconductor package and method of manufacturing thereof | Heng Wang, Tzu-Han Hsu | 2017-08-01 |
| 9620445 | Chip package structure and method of manufacturing the same | Tzu-Han Hsu | 2017-04-11 |