Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735092 | Manufacturing method of chip package structure | Yu-Tang Pan | 2017-08-15 |
| 9728479 | Multi-chip package structure, wafer level chip package structure and manufacturing process thereof | — | 2017-08-08 |
| 9653429 | Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof | — | 2017-05-16 |