ZY

Zhongyao Yu

NC National Center For Advanced Packaging Co.: 1 patents #1 of 14Top 8%
Overall (2017): #87,867 of 506,227Top 20%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9730329 Active chip package substrate and method for preparing the same Xia Zhang 2017-08-08
9583418 Chip embedded package method and structure Xueping Guo 2017-02-28