Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653437 | Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate | R. Scott West, Tao Tong, Michael Solomensky | 2017-05-16 |
| 9627436 | Substrate free LED package | Gerry Keller, Scott West, Tao Tong, Babak Imangholi | 2017-04-18 |