Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9825009 | Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the same | Charles W. C. Lin | 2017-11-21 |
| 9640518 | Semiconductor package with package-on-package stacking capability and method of manufacturing the same | Charles W. C. Lin | 2017-05-02 |
| 9570372 | Thermally enhanced semiconductor assembly with heat spreader and integrated dual build-up circuitries and method of making the same | Charles W. C. Lin | 2017-02-14 |