Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728439 | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach | Chenghong Li | 2017-08-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728439 | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach | Chenghong Li | 2017-08-08 |