Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9642265 | Dense out of plane interconnect inside hermetically sealed modules | — | 2017-05-02 |
| 9627864 | Detachable interface for high powered electronic modules | Kevin W. Sliech, Jared Majcher | 2017-04-18 |