Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9693445 | Printed circuit board with thermal via | Hyun Mo Ku, Jin Jeong, Chris Y. Chung | 2017-06-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9693445 | Printed circuit board with thermal via | Hyun Mo Ku, Jin Jeong, Chris Y. Chung | 2017-06-27 |