Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601405 | Semiconductor package with an enhanced thermal pad | Liu Mei Lee, Chee Wei Ong Khaw, Ewe Lee Lim | 2017-03-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601405 | Semiconductor package with an enhanced thermal pad | Liu Mei Lee, Chee Wei Ong Khaw, Ewe Lee Lim | 2017-03-21 |