Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9781519 | Molded interconnect mircoelectromechanical system (MEMS) device package | — | 2017-10-03 |
| 9661421 | Microphone package with molded spacer | Jay Scott Salmon | 2017-05-23 |
KS
Kuldeep Saxena
Akustica: 1 patents #1 of 4Top 25%
Overall (2017): #131,366 of 506,227Top 30%
2
Patents 2017