Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851158 | Heat sink structure | Sheng-Huang Lin | 2017-12-26 |
| 9827607 | Mold for molding a case of a mobile device and molding method for manufacturing a case of a mobile device | Fei Shi | 2017-11-28 |
| 9802280 | Heat sink structure and manufacturing method thereof | Sheng-Huang Lin | 2017-10-31 |
| 9618274 | Thermal module with enhanced assembling structure | Sheng-Huang Lin | 2017-04-11 |
| 9604328 | Heat sink structure and method of manufacturing same | Sheng-Huang Lin | 2017-03-28 |
| 9566629 | Mold for molding a case of a mobile device | Fei Shi | 2017-02-14 |
| 9550226 | Heat-dissipating device and method for manufacturing the same | Sheng-Huang Lin | 2017-01-24 |