HY

Hung-Lin Yin

AM Asia Pacific Microsystems: 1 patents #1 of 2Top 50%
Overall (2017): #396,315 of 506,227Top 80%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9553055 Method for fabricating semiconductor devices having reinforcing elements — 2017-01-24