Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9722098 | Semiconductor device package and method of manufacturing the same | Kam Cheong Chung, Liang Peng Cheng, Lai Theng Chan | 2017-08-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9722098 | Semiconductor device package and method of manufacturing the same | Kam Cheong Chung, Liang Peng Cheng, Lai Theng Chan | 2017-08-01 |