Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9840788 | Method for electrochemically depositing metal on a reactive metal film | Ismail Emesh, Dimitrios Argyris, Serdar Aksu | 2017-12-12 |
| 9828687 | Method for electrochemically depositing metal on a reactive metal film | Ismail Emesh, Dimitrios Argyris, Serdar Aksu | 2017-11-28 |
| 9805976 | Co or Ni and Cu integration for small and large features in integrated circuits | Ismail Emesh | 2017-10-31 |
| 9768060 | Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD | Ismail Emesh | 2017-09-19 |
| 9758896 | Forming cobalt interconnections on a substrate | John W. Lam, Timothy Bochman | 2017-09-12 |
| 9704717 | Electrochemical plating methods | John W. Lam, Ismail Emesh | 2017-07-11 |
| 9691660 | Method for forming interconnects | — | 2017-06-27 |
| 9613825 | Photoresist strip processes for improved device integrity | Kirk Ostrowski, David Cheung, Joon Park, Bayu Thedjoisworo, Patrick J. Lord | 2017-04-04 |