Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9839133 | Low-area overhead connectivity solutions to SIP module | Meng Chi Lee, Scott L. Gooch, Dennis R. Pyper, Amir Salehi | 2017-12-05 |
| 9820373 | Thermal solutions for system-in-package assemblies in portable electronic devices | Carlos Ribas, Deniz Teoman, Michael Eng | 2017-11-14 |
| 9618564 | Printed circuits with sacrificial test structures | Sean Anthony Mayo | 2017-04-11 |