Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780040 | Integrated circuit package substrates having a common die dependent region and methods for designing the same | Swee Fong Chong, Pheak Ti Teh | 2017-10-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780040 | Integrated circuit package substrates having a common die dependent region and methods for designing the same | Swee Fong Chong, Pheak Ti Teh | 2017-10-03 |