Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9831218 | Wafer to wafer stacking | Michael J. Hart | 2017-11-28 | $25,700,000 |
| 9607948 | Method and circuits for communication in multi-die packages | Vassili Kireev | 2017-03-28 | $9,601,000 |
| 9575111 | On chip detection of electrical overstress events | Michael J. Hart, John K. Jennings | 2017-02-21 | $30,229,000 |
| 9548738 | High voltage RC-clamp for electrostatic discharge (ESD) protection | — | 2017-01-17 | $33,411,000 |