Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806014 | Interposer with beyond reticle field conductor pads | Michael Alfano, Michael Z. Su, Joseph Siegel, Julius Din, Anwar Kashem | 2017-10-31 |
| 9793239 | Semiconductor workpiece with selective backside metallization | Michael Z. Su, Michael Alfano | 2017-10-17 |
| 9627281 | Semiconductor chip with thermal interface tape | Seth Prejean, Dales Morrison Kent, Ronnie Brandon, Gamal Refai-Ahmed, Michael Z. Su +2 more | 2017-04-18 |