Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9685430 | Embedded package and method thereof | Zhiqiang Niu, Ming-Chen Lu, Yueh-Se Ho, Jun Lu | 2017-06-20 |
| 9646920 | Power semiconductor device with small contact footprint and the preparation method | Hongtao Gao, Jun Lu, Ming-Chen Lu, Jianxin Ye, Yan Huo | 2017-05-09 |