Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9622344 | Multilayer wiring board with enclosed Ur-variant dual conductive layer | Takayasu Sugai, Toshiyuki Kudo, Toshinori Omori | 2017-04-11 |
| 9535090 | Electric connecting apparatus | Hidehiro Kiyofuji, Osamu Arai | 2017-01-03 |