Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613847 | Integration of shallow trench isolation and through-substrate vias into integrated circuit designs | Mark A. Bachman, John W. Osenbach | 2017-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613847 | Integration of shallow trench isolation and through-substrate vias into integrated circuit designs | Mark A. Bachman, John W. Osenbach | 2017-04-04 |