KL

Keng Hung Lin

AB Adventive Ip Bank: 2 patents #2 of 2Top 100%
Overall (2017): #133,755 of 506,227Top 30%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9620439 Low-profile footed power package Richard K. Williams 2017-04-11
9576932 Universal surface-mount semiconductor package Richard K. Williams 2017-02-21