Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852971 | Interposer, semiconductor package structure, and semiconductor process | Min-Lung Huang | 2017-12-26 |
| 9853011 | Semiconductor package structure and method for manufacturing the same | — | 2017-12-26 |
| 9831195 | Semiconductor package structure and method of manufacturing the same | — | 2017-11-28 |