Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9373577 | Hybrid semiconductor package | Brian Condie, Erwin Orejola, Michael Opiz Real | 2016-06-21 |
| 9293407 | Semiconductor package having a baseplate with a die attach region and a peripheral region | Soon Ing Chew, Brian Condie | 2016-03-22 |