Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449897 | Chip package and method for forming the same | Bai-Yao Lou, Shih-Kuang Chen | 2016-09-20 |
| 9443842 | Integrated circuit device | Yin-Ku Chang | 2016-09-13 |
| 9443843 | Integrated circuit device | Yin-Ku Chang | 2016-09-13 |
| 9444165 | Pin arrangement and electronic assembly | — | 2016-09-13 |
| 9338879 | Through-hole layout structure including first and second pairs of differential signal through-holes disposed between three ground through-holes | — | 2016-05-10 |