Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9374892 | Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components | Roupen Leon Keusseyan | 2016-06-21 |
| 9337060 | Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components | Roupen Leon Keusseyan | 2016-05-10 |
| 9236274 | Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components | Roupen Leon Keusseyan | 2016-01-12 |