Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343499 | Integrated circuit stack with strengthened wafer bonding | Hsin-Neng Tai, Hung-Ming Weng, Chih-huei Wu | 2016-05-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343499 | Integrated circuit stack with strengthened wafer bonding | Hsin-Neng Tai, Hung-Ming Weng, Chih-huei Wu | 2016-05-17 |