Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349615 | SiP system-integration IC chip package and manufacturing method thereof | Jianyou Xie, Xizhou Li, Wei Mu, Yongzhong Wang | 2016-05-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349615 | SiP system-integration IC chip package and manufacturing method thereof | Jianyou Xie, Xizhou Li, Wei Mu, Yongzhong Wang | 2016-05-24 |