Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9331051 | Wafer scale technique for interconnecting vertically stacked dies | Pinxiang Duan, Oded Raz, Harmen Joseph Sebastiaan Dorren | 2016-05-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9331051 | Wafer scale technique for interconnecting vertically stacked dies | Pinxiang Duan, Oded Raz, Harmen Joseph Sebastiaan Dorren | 2016-05-03 |