Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484350 | Semiconductor device having an inter-layer via (ILV), and method of making same | Hong-Chen Cheng, Cheng Hung Lee, Hung-Jen Liao | 2016-11-01 |
| 9312856 | Scheme for 3D voltage type TSV signal transmission | Meng-Fan Chang, Pei-Yuan Li | 2016-04-12 |
| 9297597 | Combination heat sink assembly | — | 2016-03-29 |