Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449886 | Semiconductor device and formation thereof | I-Wen Wu, Hsien-Cheng Wang, Mei-Yun Wang, Hsiao-Chiu Hsu, Shih-Wen Liu | 2016-09-20 |
| 9425048 | Mechanisms for semiconductor device structure | Mei-Yun Wang, Hsien-Cheng Wang, Fu-Kai Yang, Shih-Wen Liu, Audrey Hsiao-Chiu Hsu | 2016-08-23 |
| 9331173 | Semiconductor device having a carbon containing insulation layer formed under the source/drain | Shih-Wen Liu, Mei-Yun Wang, Hsien-Cheng Wang, Fu-Kai Yang, Hsiao-Chiu Hsu | 2016-05-03 |
| 9318488 | Semiconductor device and formation thereof | I-Wen Wu, Mei-Yun Wang, Hsien-Cheng Wang, Shih-Wen Liu, Hsiao-Chiu Hsu | 2016-04-19 |
| 9312259 | Integrated circuit structure with thinned contact | Mei-Yun Wang, Hsien-Cheng Wang, Shih-Wen Liu, Fu-Kai Yang, Audrey Hsiao-Chiu Hsu | 2016-04-12 |
| 9299657 | Semiconductor device and method for manufacturing semiconductor device | Audrey Hsiao-Chiu Hsu, Fu-Kai Yang, Mei-Yun Wang, Hsien-Cheng Wang, Shih-Wen Liu | 2016-03-29 |