HL

Hsiang-Wei Lin

TSMC: 2 patents #914 of 2,623Top 35%
📍 New Taipei, TW: #363 of 2,260 inventorsTop 20%
Overall (2016): #137,195 of 481,213Top 30%
2
Patents 2016

Issued Patents 2016

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9425091 Method for forming semiconductor structure Yi-Nien Su 2016-08-23
9385037 Semiconductor arrangement comprising metal cap and dielectric layer defining air gap 2016-07-05