Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343352 | Integrated circuit using deep trench through silicon (DTS) | Kuo-Yu Cheng, Wei-Kung Tsai, Kuan-Chi Tsai, Tsung-Yu Yang, Chun-Hong Chen +3 more | 2016-05-17 |
| 9269591 | Handle wafer for high resistivity trap-rich SOI | Alex Kalnitsky, Yung-Chih Tsai, Tsung-Yu Yang, Keng-Yu Chen, Yong-En Syu | 2016-02-23 |
| 9230988 | Mechanisms for forming radio frequency (RF) area of integrated circuit structure | Kuo-Yu Cheng, Keng-Yu Chen, Wei-Kung Tsai, Kuan-Chi Tsai, Tsung-Yu Yang +2 more | 2016-01-05 |