Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418948 | Method of making bond pad | Chun-Che Huang, Shih-Chieh Chang | 2016-08-16 |
| 9263316 | Method for forming a semiconductor device with void-free shallow trench isolation | Shang-Yen Wu, Ping-Pang Hsieh | 2016-02-16 |
| 9252109 | Method of making bond pad | Chun-Che Huang, Shih-Chieh Chang | 2016-02-02 |