Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508716 | Methods of manufacturing a semiconductor device | Cheng-Tung Lin, Teng-Chun Tsai, Li-Ting Wang, Kuo-Yin Lin, Wan-Chun Pan +5 more | 2016-11-29 |
| 9287170 | Contact structure and formation thereof | Hong-Mao Lee, Teng-Chun Tsai, Li-Ting Wang, Cheng-Tung Lin, Chi-Hsuan Ni +4 more | 2016-03-15 |
| 9245797 | Opening fill process and structure formed thereby | Chun-I Tsai, Wei-Jung Lin, Chia-Han Lai | 2016-01-26 |