Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9399725 | Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same | Etsu Takeuchi, Hiromichi Sugiyama, Toshiharu Kuboyama, Masakazu Kawata | 2016-07-26 |