Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466586 | Method for manufacturing wafer-level fan-out package | Jai Kyoung Choi, Eun Dong Kim, Hyeong Min KIM, Su Kyung Lim | 2016-10-11 |
| 9347806 | Sensor having an embedded electrode, and method for manufacturing same | Sun-Ki Kim, Sung Youl Kim, Jung Suk Kim | 2016-05-24 |
| 9349667 | Method of manufacturing stacked package | Jae Bok YOO, Kyoung Min Song | 2016-05-24 |