Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449896 | Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method | Sandrine Lhostis, Yann Beilliard, Vincent Fiori | 2016-09-20 |
| 9418954 | Integrated circuit chip assembled on an interposer | Pierre Bar, Alisee Taluy | 2016-08-16 |