Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9525067 | Method for forming integrated circuits on a strained semiconductor substrate | Daniel Bensahel | 2016-12-20 |
| 9460923 | Method of forming a strained silicon layer | Jean-Michel Hartmann | 2016-10-04 |
| 9356094 | Method for making a semi-conducting substrate located on an insulation layer | Daniel Bensahel | 2016-05-31 |
| 9330957 | Process for assembling two wafers and corresponding device | Marc Zussy | 2016-05-03 |