Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425125 | Silicon-glass hybrid interposer circuitry | — | 2016-08-23 |
| 9385060 | Integrated circuit package with enhanced thermal conduction | Vincent Hool | 2016-07-05 |
| 9245895 | Oro and orpro with bit line trench to suppress transport program disturb | Ning Cheng, Kuo-Tung Chang, Hiro Kinoshita, Chih-Yuh Yang, Lei Xue +3 more | 2016-01-26 |