Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287307 | Chip size package (CSP) | Toshihiro Furusawa, Yoshiteru Kamatani, Yoshihito Higashitsutsumi | 2016-03-15 |
| 9253387 | Camera module and camera apparatus and parallel link mechanism for reciprocating an image pickup device | Toshihiro Furusawa, Yoshihito Higashitsutsumi, Yoshiteru Kamatani, Hideo Kawabe, Takehisa Ishida +4 more | 2016-02-02 |