Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418875 | Substrate including a dam for semiconductor package, semiconductor package using the same, and manufacturing method thereof | — | 2016-08-16 |
| 9257413 | Stack packages including diffusion barriers over sidewalls of through via electrodes and methods of manufacturing the same | Jong Hoon Kim, Tac Keun OH, Song NA | 2016-02-09 |