Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412716 | Semiconductor package and method for manufacturing the same | Jin Ho Bae, Seong Kweon Ha, Jong Hyun Kim, Bok Gyu MIN, Jae Won Shin | 2016-08-09 |
| 9368456 | Semiconductor package having EMI shielding and method of fabricating the same | — | 2016-06-14 |
| 9305895 | Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same | Jong Woo Yoo | 2016-04-05 |
| 9252136 | Package stacked device | Seung Jee KIM | 2016-02-02 |