Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478515 | Semiconductor packages including interconnection members | — | 2016-10-25 |
| 9275968 | Flip chip packages having chip fixing structures, electronic systems including the same, and memory cards including the same | Si Eon Kim, Jong Woo Ahn | 2016-03-01 |
| 9230915 | Semiconductor packages including through electrodes and methods of manufacturing the same | Il Hwan Cho | 2016-01-05 |