Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490187 | Semiconductor package on which semiconductor chip is mounted on substrate with window | — | 2016-11-08 |
| 9305912 | Stack package and method for manufacturing the same | Hee Min SHIN, Eun Hye DO, Ji Eun Kim, Kyu Won Lee | 2016-04-05 |