Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343387 | Package on package structure and fabrication method thereof | Chu-Chi Hsu, Lung-Yuan Wang, Cheng-Chia Chiang, Chia-Kai Shih | 2016-05-17 |
| 9343421 | Semiconductor package and fabrication method thereof | Lung-Yuan Wang, Cheng-Chia Chiang, Chu-Chi Hsu, Chia-Kai Shih | 2016-05-17 |